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Trenz Electronic GmbH TE0803-02-03EG-1EA

Part No.:
TE0803-02-03EG-1EA
Manufacturer:
Trenz Electronic GmbH
Category:
Microcontrollers, Microprocessor, FPGA Modules
Package:
Description:
IC MODULE ZYNQ USCALE 2GB 128MB
Quantity:

Unit Price:$0

Ext Price:$0

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TE0803-02-03EG-1EA Information

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Attribute value
Manufacturer:
Trenz Electronic GmbH
Series:
TE0803
Packaging:
Bulk
Product Status:
Obsolete
Module/Board Type:
MPU Core
Core Processor:
Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
2GB
Connector Type:
B2B
Size / Dimension:
2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature:
0°C ~ 85°C
Image TE0803-04-2AE11-A TE0803-04-4BE11-A TE0803-04-4DE21-L TE0803-04-4GE21-L TE0803-04-5DI21-A
Part Number TE0803-04-2AE11-A TE0803-04-4BE11-A TE0803-04-4DE21-L TE0803-04-4GE21-L TE0803-04-5DI21-A
Manufacturer Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH
Series TE0803 TE0803 TE0803 TE0803 TE0803
Packaging Bulk Bulk Bulk Bulk Bulk
Product Status Active Active Active Active Active
Module/Board Type MPU Core MPU Core MPU Core MPU Core MPU Core
Core Processor Zynq UltraScale+ XCZU2CG-1SFVC784E Zynq UltraScale+ XCZU4EG-1SFVC784E Zynq UltraScale+ XCZU4EV-1SFVC784E Zynq™ UltraScale+™ XCZU4EG-2SFVC784E Zynq UltraScale+ XCZU5EV-1SFVC784I
Co-Processor - - - - -
Speed - - - - -
Flash Size 128MB 128MB 128MB 128MB 128MB
RAM Size 2GB 2GB 4GB 4GB 4GB
Connector Type B2B B2B B2B Board-to-Board (BTB) Socket - 160 B2B
Size / Dimension 2.050" L x 2.990" W (52.00mm x 76.00mm) 2.050" L x 2.990" W (52.00mm x 76.00mm) 2.050" L x 2.990" W (52.00mm x 76.00mm) 2.990" L x 2.050" W (76.00mm x 52.00mm) 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature 0°C ~ 85°C 0°C ~ 85°C 0°C ~ 85°C 0°C ~ 85°C -40°C ~ 85°C
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