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Trenz Electronic GmbH TE0720-03-31C33MA

Part No.:
TE0720-03-31C33MA
Manufacturer:
Trenz Electronic GmbH
Category:
Microcontrollers, Microprocessor, FPGA Modules
Package:
Datasheet:
TE0720-03-31C33MA.pdf
Description:
IC SOC MODULE XILINX ZYNQ
Quantity:

Unit Price:$0

Ext Price:$0

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TE0720-03-31C33MA Information

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Product attributes
Attribute value
Manufacturer:
Trenz Electronic GmbH
Series:
TE0720
Packaging:
Bulk
Product Status:
Obsolete
Module/Board Type:
MCU, FPGA
Core Processor:
ARM Cortex-A9
Co-Processor:
Zynq-7000 (Z-7014S)
Speed:
766MHz
Flash Size:
8GB
RAM Size:
1GB
Connector Type:
Samtec LSHM
Size / Dimension:
1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature:
0°C ~ 70°C
Image TE0720-04-61C530A TE0720-04-62I33ML TE0720-04-61Q33MA TE0720-04-62I33MA TE0720-04-62I33NA
Part Number TE0720-04-61C530A TE0720-04-62I33ML TE0720-04-61Q33MA TE0720-04-62I33MA TE0720-04-62I33NA
Manufacturer Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH
Series - - - - -
Packaging Bulk Bulk Bulk Bulk Bulk
Product Status Active Active Active Active Active
Module/Board Type Ethernet Core Ethernet Core Ethernet Core Ethernet Core Ethernet Core
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9
Co-Processor - - - - -
Speed - - - - -
Flash Size 32MB 32MB 32MB 32MB 32MB
RAM Size 256MB 1GB 1GB 1GB 1GB
Connector Type Board-to-Board (BTB) Socket Board-to-Board (BTB) Socket Board-to-Board (BTB) Socket Board-to-Board (BTB) Socket Board-to-Board (BTB) Socket
Size / Dimension 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature 0°C ~ 70°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
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