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| Part Number | TDF8541J/N3,112 | TDF8541JS/N3,512 | TDF8541JV/N3ZU | TDF8541J/N2,112 | TDF8541JS/N2,512 |
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Series | - | - | - | - | - |
| Package/Case | 27-SIP, Formed Leads | 27-PowerSMD Module | 27-SIP, Formed Leads | 27-SIP, Formed Leads | 27-PowerSMD Module |
| Packaging | Tube | Tube | Tube | Tube | Tube |
| Product Status | Active | Active | Active | Obsolete | Obsolete |
| Type | Class AB | Class AB | - | Class AB | Class AB |
| Output Type | 4-Channel (Quad) | 4-Channel (Quad) | - | 4-Channel (Quad) | 4-Channel (Quad) |
| Max Output Power x Channels @ Load | 64W x 4 @ 2Ohm | 64W x 4 @ 2Ohm | - | 64W x 4 @ 2Ohm | 64W x 4 @ 2Ohm |
| Voltage - Supply | 6V ~ 18V | 6V ~ 18V | - | 6V ~ 18V | 6V ~ 18V |
| Features | Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby | Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby | - | Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby | Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby |
| Mounting Type | Through Hole | Surface Mount | Through Hole | Through Hole | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | - | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Grade | - | - | - | - | - |
| Qualification | - | - | - | - | - |
| Supplier Device Package | DBS27P | 27-DBSMSP | DBS27P | DBS27P | 27-DBSMSP |
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