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IXYS MMIX4B22N300

Part No.:
MMIX4B22N300
Manufacturer:
IXYS
Category:
IGBT Arrays
Package:
24-SMD Module, 9 Leads
Description:
IGBT TRANS 3000V 38A
Quantity:

Unit Price:$0

Ext Price:$0

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Product Details

MMIX4B22N300 - IXYS Power Semiconductor Module

MMIX4B22N300 is a power semiconductor module from IXYS, intended for industrial power conversion and high-reliability electronic systems. It is commonly considered for designs that require robust power handling, compact module integration, and stable electrical performance in demanding operating environments.

This page is written for product identification and engineering selection guidance. Always verify final ratings, terminal definitions, and thermal limits using the manufacturer's latest datasheet revision for design sign-off.

Overview

MMIX4B22N300 belongs to the IXYS power semiconductor portfolio and is designed for applications that require efficient power-stage implementation in a module form factor. Compared with discrete solutions, module-based devices can simplify assembly, reduce layout complexity, and improve consistency in power system integration.

It is typically evaluated for use in rectification, conversion, or industrial power control stages where electrical robustness, thermal management, and long-term operating stability are important. For system-level design, engineers should review not only the headline voltage/current capability, but also isolation, mounting, thermal resistance, and surge-related performance.

Selection note: For power modules, the most important checks are usually voltage class, current handling, thermal path, isolation requirements, and mechanical footprint compatibility. Final selection should always be based on the official IXYS documentation.

Key Advantages

Module-based integration for simplified design

Compared with multi-device discrete layouts, a module solution can help streamline assembly and reduce board or chassis integration complexity.

Suitable for industrial power stages

Designed for applications where reliable electrical switching or rectification performance is required under practical thermal and mechanical constraints.

Improved thermal/mechanical consistency

Power modules are often preferred in systems that need repeatable mounting, stable thermal coupling, and easier service replacement.

Trusted IXYS power device platform

IXYS is widely recognized in the power semiconductor field, especially for industrial, motion-control, and power-conversion applications.

Feature Summary

Power semiconductor module structure

Integrates the power path into a module package for easier mechanical and electrical implementation.

Engineered for high-power circuitry

Appropriate for systems where voltage withstand capability, current handling, and thermal behavior are critical design factors.

Industrial-grade mounting concept

Typically suited to fixed installation in converters, drives, rectifier stages, or auxiliary power assemblies.

Original IXYS device identification

Useful for maintenance, BOM matching, sourcing validation, and replacement assessment in existing equipment.

Package & Footprint

The MMIX4B22N300 is supplied in a power module style package intended for mechanical fastening and practical heat dissipation in industrial assemblies. Exact housing dimensions, creepage/clearance, terminal layout, and mounting torque requirements should be confirmed from the official package drawing.

Package Image Placeholder
(replace with real package photo/drawing)
Practical notes
  • Confirm heatsink flatness and mounting pressure before volume assembly.
  • Use the manufacturer-recommended torque values for terminal and base mounting hardware.
  • Check insulation, spacing, and airflow conditions in the final enclosure.

Note: Exact package size, hole pattern, and terminal arrangement must be verified using the latest IXYS datasheet.

Pin Functions

The MMIX4B22N300 terminal arrangement depends on the exact internal circuit topology defined by IXYS. In power modules, terminals commonly map to main power paths, module connection nodes, and in some cases auxiliary or mounting-related references. Always match the silkscreen and wiring against the official terminal diagram before installation.

Power Terminals
Main current-carrying terminals used for the module's primary power path. Cable lug, busbar, or screw-terminal compatibility should be checked in advance.
Input / Output Nodes
Depending on the internal topology, these terminals may represent AC/DC, anode/cathode, or other functional power connections.
Base / Mounting Reference
Mechanical installation and insulation structure are important for thermal transfer and safety spacing in high-power systems.
Marking / Orientation
Before assembly, verify terminal numbering and polarity/orientation marks to prevent reverse installation or wiring errors.
Pinout Diagram Placeholder
(replace with official pinout drawing)

For power modules, incorrect terminal mapping can cause immediate damage. Use the official datasheet drawing during assembly and incoming inspection.

Key Specifications

Part Number MMIX4B22N300
Manufacturer IXYS
Product Category Power Semiconductor Module
Technology Refer to official datasheet
Configuration Refer to official datasheet / internal circuit diagram
Voltage Rating Refer to official datasheet
Current Rating Refer to official datasheet
Package Type Industrial Power Module
Mounting Style Panel / Heatsink / Module Mount
Base Product MMIX4B22N300

Equivalent

For MMIX4B22N300, equivalent selection should be handled carefully because power modules are highly dependent on electrical topology, terminal arrangement, mechanical footprint, and thermal behavior. Even when headline ratings appear similar, modules may not be directly interchangeable.

  • Form-fit-function check: verify internal circuit configuration first
  • Mechanical check: confirm mounting holes, terminal position, and overall size
  • Thermal check: compare thermal resistance and heatsink interface requirements
  • Compliance check: confirm insulation, safety, and qualification requirements

No direct substitute should be approved without datasheet-to-datasheet comparison and application-level validation.

Manufacturer Information

IXYS is well known in the power semiconductor market for devices used in rectification, power conversion, motor control, industrial automation, renewable energy, and other high-power electronics applications. The brand has long been associated with robust discrete and module-level power solutions.

  • Core strengths: Power semiconductors, modules, rectifiers, thyristors, IGBTs and related power technologies
  • Typical markets: Industrial power systems, drives, automation, energy conversion, transportation equipment
  • Engineering focus: Electrical robustness, thermal reliability, and practical integration into power assemblies

Applications

The MMIX4B22N300 is relevant to industrial and power electronic systems where module-level power handling, reliability, and maintainability are important. Typical application fields may include:

Industrial Power Supplies

Industrial Power Supplies

Used in rectification or power conditioning stages where stable module installation and serviceability are important.

Motor Drive Systems

Motor Drive Systems

Suitable for drive-related power sections that require durable semiconductor hardware and predictable thermal behavior.

Energy Conversion Equipment

Energy Conversion Equipment

Applicable in converter and auxiliary power systems that benefit from compact power module implementation.

Maintenance and Replacement Projects

Maintenance & Replacement

Often referenced in equipment repair, spare-part verification, and legacy industrial system support.

Quality & Authenticity

  • Incoming inspection: part marking, housing condition, terminal integrity, and package label consistency
  • Traceability: preserve supplier, lot, and date code information for critical maintenance records
  • Storage control: protect terminals and insulation surfaces from moisture, contamination, and mechanical damage
  • Anti-counterfeit: for critical repairs or safety-related systems, use controlled sourcing and enhanced verification
Note: For power modules used in industrial equipment, it is good practice to confirm labeling, origin, electrical category, and mechanical condition before installation.

FAQ

Is MMIX4B22N300 a direct drop-in replacement for other IXYS modules?
Not necessarily. Power modules must be checked for internal topology, terminal layout, mounting size, insulation structure, and thermal performance before any substitution is approved.
What should I verify before using MMIX4B22N300 in a repair project?
Confirm the exact part number, internal circuit type, voltage/current class, package outline, mounting hardware requirements, and the original equipment wiring arrangement.
What should be included in an RFQ for this part?
Include quantity, target delivery date, acceptable date code range, traceability requirements, packaging condition, and whether test reports or compliance documents are required.

Disclaimer

Important Notice: The information on this page is provided for reference and product identification purposes. Electrical characteristics, package dimensions, internal topology, and terminal definitions must be confirmed using the official manufacturer datasheet. For design, qualification, replacement approval, and safety decisions, always rely on original IXYS documentation and application-level validation.

MMIX4B22N300 Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
IXYS
Series:
BIMOSFET™
Package/Case:
24-SMD Module, 9 Leads
Packaging:
Tube
Product Status:
Active
IGBT Type:
-
Configuration:
Full Bridge
Voltage - Collector Emitter Breakdown (Max):
3000 V
Current - Collector (Ic) (Max):
38 A
Power - Max:
150 W
Vce(on) (Max) @ Vge, Ic:
2.7V @ 15V, 22A
Current - Collector Cutoff (Max):
35 µA
Input Capacitance (Cies) @ Vce:
2.2 nF @ 25 V
Input:
Standard
NTC Thermistor:
No
Operating Temperature:
-55°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
24-SMPD
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