Samtec Inc. HIC-764-SST

Product attributes

Attribute value

Manufacturer:

Samtec Inc.

Series:

HIC

Packaging:

Tube

Product Status:

Obsolete

Type:

DIP, 0.75" (19.05mm) Row Spacing

Number of Positions or Pins (Grid):

64 (2 x 32)

Pitch - Mating:

0.070" (1.78mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

10.0µin (0.25µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Open Frame

Termination:

Solder

Pitch - Post:

0.070" (1.78mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

200.0µin (5.08µm)

Contact Material - Post:

Brass

Housing Material:

Polyester, Glass Filled

Operating Temperature:

-