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Amphenol ICC (FCI) DILB18P-223TLF
- Part No.:
- DILB18P-223TLF
- Manufacturer:
- Amphenol ICC (FCI)
- Category:
- IC Sockets
- Package:
- Datasheet:
-
DILB18P-223TLF.pdf
- Description:
- CONN IC DIP SOCKET 18POS TINLEAD
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
DILB18P-223TLF Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Amphenol ICC (FCI)
- Series:
- DILB
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):
- 18 (2 x 9)
- Pitch - Mating:
- 0.100" (2.54mm)
- Contact Finish - Mating:
- Tin-Lead
- Contact Finish Thickness - Mating:
- 100.0µin (2.54µm)
- Contact Material - Mating:
- Copper Alloy
- Mounting Type:
- Through Hole
- Features:
- Open Frame
- Termination:
- Solder
- Pitch - Post:
- 0.100" (2.54mm)
- Contact Finish - Post:
- Tin-Lead
- Contact Finish Thickness - Post:
- 100.0µin (2.54µm)
- Contact Material - Post:
- Copper Alloy
- Housing Material:
- Polyamide (PA), Nylon
- Operating Temperature:
- -55°C ~ 125°C
| Image |  |
| Part Number | DILB18P-223TLF |
| Manufacturer | Amphenol ICC (FCI) |
| Series | DILB |
| Packaging | Tube |
| Product Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 18 (2 x 9) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Polyamide (PA), Nylon |
| Operating Temperature | -55°C ~ 125°C |
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