AR 32-HZL/01-TT.pdf
Unit Price:$0
Ext Price:$0



| Image | ![]() |
![]() |
![]() |
![]() |
| Part Number | AR 32-HZL/01-TT | AR 32-HZL-TT | AR 32 HGL-TT | AR 32-HZL/07-TT |
| Manufacturer | Assmann WSW Components | Assmann WSW Components | Assmann WSW Components | Assmann WSW Components |
| Series | - | - | AR | - |
| Packaging | Tube | Tube | Bulk | Tube |
| Product Status | Active | Active | Active | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 32 (2 x 16) | 32 (2 x 16) | 32 | 32 (2 x 16) |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Tin | Gold | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | - | Flash | 30.0µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Features | Open Frame | Open Frame | Open Frame | Open Frame |
| Termination | Solder | Solder | Solder | Solder |
| Pitch - Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Post | Tin | Tin | Gold | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) | 200.0µin (5.08µm) | Flash | 200.0µin (5.08µm) |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | Brass | Beryllium Copper |
| Housing Material | Thermoplastic, Polyester | Polybutylene Terephthalate (PBT), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled | Thermoplastic, Polyester |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C |
The following parts include "AR 32-HZL/01-TT" in Silicon Labs AR 32-HZL/01-TT.
The following parts are popular search parts in Test and Measurement.