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Assmann WSW Components AR 28-HZL/01-TT

Name: AR 28-HZL/01-TT
Brand: Assmann WSW Components
SKU: AR 28-HZL/01-TT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: AR 28-HZL/01-TT

Manufacturer:: Assmann WSW Components

Category:: IC Sockets

Package:

Datasheet:: AR 28-HZL/01-TT.pdf

Description:: CONN IC DIP SOCKET 28POS GOLD

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AR 28-HZL/01-TT Information

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Product attributes: Attribute value

Manufacturer:: Assmann WSW Components

Series:: -

Packaging:: Tube

Product Status:: Active

Type:: DIP, 0.6" (15.24mm) Row Spacing

Number of Positions or Pins (Grid):: 28 (2 x 14)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 10.0µin (0.25µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Tin

Contact Finish Thickness - Post:: 200.0µin (5.08µm)

Contact Material - Post:: Beryllium Copper

Housing Material:: Thermoplastic, Polyester

Operating Temperature:: -40°C ~ 105°C

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Part Number	AR 28-HZL/01/7-TT	AR 28-HZL-TT	AR 28-HZL/01-TT	AR 28-HZW/TN	AR 28-HZL/7-TT
Manufacturer	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components
Series	-	-	-	-	-
Packaging	Tube	Tube	Tube	Tube	Tube
Product Status	Active	Active	Active	Active	Active
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)	28 (2 x 14)	28 (2 x 14)	28 (2 x 14)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Tin	Gold	Gold	Tin
Contact Finish Thickness - Mating	10.0µin (0.25µm)	-	10.0µin (0.25µm)	-	-
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Open Frame	Open Frame
Termination	Solder	Solder	Solder	Wire Wrap	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Tin	Tin	Tin	Tin	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Housing Material	Thermoplastic, Polyester	Thermoplastic, Polyester	Thermoplastic, Polyester	Thermoplastic, Polyester	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C