Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

Assmann WSW Components AR 20-HZL-TT

Name: AR 20-HZL-TT
Brand: Assmann WSW Components
SKU: AR 20-HZL-TT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: AR 20-HZL-TT

Manufacturer:: Assmann WSW Components

Category:: IC Sockets

Package:

Datasheet:: AR 20-HZL-TT.pdf

Description:: CONN IC DIP SOCKET 20POS TIN

Quantity:: Add To Cart Add To RFQ list

Unit Price:$0

Ext Price:$0

Payment:

Shipping:

AR 20-HZL-TT Information

Specifications
Comparison
Tags

Product attributes: Attribute value

Manufacturer:: Assmann WSW Components

Series:: -

Packaging:: Tube

Product Status:: Active

Type:: DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):: 20 (2 x 10)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Tin

Contact Finish Thickness - Mating:: -

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Tin

Contact Finish Thickness - Post:: 200.0µin (5.08µm)

Contact Material - Post:: Beryllium Copper

Housing Material:: Thermoplastic, Polyester

Operating Temperature:: -40°C ~ 105°C

Image
Part Number	AR 20-HZL-TT	AR 20-HZW/TN	AR 20 HGL-TT	AR 20-HZL/01-TT	AR 20-HZL/07-TT
Manufacturer	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components	Assmann WSW Components
Series	-	-	AR	-	-
Packaging	Tube	Tube	Bulk	Bulk	Tube
Product Status	Active	Active	Active	Active	Active
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	20 (2 x 10)	20 (2 x 10)	20 (2 x 10)	20 (2 x 10)	20 (2 x 10)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Tin	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	-	-	Flash	Flash	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Open Frame	Open Frame
Termination	Solder	Wire Wrap	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Tin	Tin	Gold	Tin	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)	200.0µin (5.08µm)	Flash	196.9µin (5.00µm)	200.0µin (5.08µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Brass	Beryllium Copper	Beryllium Copper
Housing Material	Thermoplastic, Polyester	Thermoplastic, Polyester	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Thermoplastic, Polyester
Operating Temperature	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C	-40°C ~ 105°C