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LOTES ACA-SPI-006-K01

Part No.:
ACA-SPI-006-K01
Manufacturer:
LOTES
Category:
IC Sockets
Package:
Datasheet:
ACA-SPI-006-K01.pdf
Description:
SPI 16 PIN_IC 300mil
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
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ACA-SPI-006-K01 Information

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Product attributes
Attribute value
Manufacturer:
LOTES
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
SOIC
Number of Positions or Pins (Grid):
16 (2 x 8)
Pitch - Mating:
0.050" (1.27mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
1.00µin (0.025µm)
Contact Material - Mating:
Phosphor Bronze
Mounting Type:
Surface Mount
Features:
Board Guide, Closed Frame
Termination:
Solder
Pitch - Post:
0.050" (1.27mm)
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
1.00µin (0.025µm)
Contact Material - Post:
Phosphor Bronze
Housing Material:
Liquid Crystal Polymer (LCP)
Operating Temperature:
-
Image ACA-SPI-004-K01 ACA-SPI-006-K01
Part Number ACA-SPI-004-K01 ACA-SPI-006-K01
Manufacturer LOTES LOTES
Series - -
Packaging Tape & Reel (TR) Tape & Reel (TR)
Product Status Active Active
Type SOIC SOIC
Number of Positions or Pins (Grid) 8 (2 x 4) 16 (2 x 8)
Pitch - Mating 0.050" (1.27mm) 0.050" (1.27mm)
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 1.00µin (0.025µm) 1.00µin (0.025µm)
Contact Material - Mating Phosphor Bronze Phosphor Bronze
Mounting Type Surface Mount Surface Mount
Features Board Guide, Closed Frame Board Guide, Closed Frame
Termination Solder Solder
Pitch - Post 0.050" (1.27mm) 0.050" (1.27mm)
Contact Finish - Post Gold Gold
Contact Finish Thickness - Post 1.00µin (0.025µm) 1.00µin (0.025µm)
Contact Material - Post Phosphor Bronze Phosphor Bronze
Housing Material Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP)
Operating Temperature - -
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