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TE Connectivity AMP Connectors 9-1437539-1

Name: 9-1437539-1
Brand: TE Connectivity AMP Connectors
SKU: 9-1437539-1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 9-1437539-1

Manufacturer:: TE Connectivity AMP Connectors

Category:: IC Sockets

Package:

Description:: 828-AG11D-ES=SOCKET ASSY

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Unit Price:$0

Ext Price:$0

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9-1437539-1 Information

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Comparison
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Product attributes: Attribute value

Manufacturer:: TE Connectivity AMP Connectors

Series:: 800

Packaging:: Box

Product Status:: Active

Type:: DIP, 0.1" (2.54mm) Row Spacing

Number of Positions or Pins (Grid):: 28 (2 x 14)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 25.0µin (0.63µm)

Contact Material - Mating:: Copper Alloy

Mounting Type:: Through Hole

Features:: -

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: -

Contact Finish Thickness - Post:: -

Contact Material - Post:: -

Housing Material:: Polyester

Operating Temperature:: -55°C ~ 105°C

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Part Number	9-1437539-1	9-1437504-0	9-1437535-4	9-1437535-1	916788-1
Manufacturer	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors
Series	800	8080	500	500	-
Packaging	Box	Bulk	Tube	Tube	Tray
Product Status	Active	Obsolete	Obsolete	Obsolete	Obsolete
Type	DIP, 0.1" (2.54mm) Row Spacing	Transistor, TO-3	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	28 (2 x 14)	3 (Oval)	14 (2 x 7)	14 (2 x 7)	462 (19 x 19)
Pitch - Mating	0.100" (2.54mm)	-	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Tin	Gold	Gold	Tin
Contact Finish Thickness - Mating	25.0µin (0.63µm)	200.0µin (5.08µm)	25.0µin (0.63µm)	25.0µin (0.63µm)	-
Contact Material - Mating	Copper Alloy	Beryllium Copper	Beryllium Copper	Beryllium Copper	Phosphor Bronze
Mounting Type	Through Hole	Chassis Mount	Through Hole	Through Hole	Through Hole
Features	-	Closed Frame	Closed Frame	Closed Frame	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	-	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	-	Tin	Gold	Gold	Tin
Contact Finish Thickness - Post	-	200.0µin (5.08µm)	25.0µin (0.63µm)	25.0µin (0.63µm)	-
Contact Material - Post	-	Beryllium Copper	Beryllium Copper	Copper Alloy	Phosphor Bronze
Housing Material	Polyester	Polytetrafluoroethylene (PTFE)	-	-	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C ~ 105°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-