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TE Connectivity AMP Connectors 808-AG11D-LF

Name: 808-AG11D-LF
Brand: TE Connectivity AMP Connectors
SKU: 808-AG11D-LF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 808-AG11D-LF

Manufacturer:: TE Connectivity AMP Connectors

Category:: IC Sockets

Package:

Description:: CONN IC DIP SOCKET 8POS GOLD

Quantity:: Add To Cart Add To RFQ list

Unit Price:$0

Ext Price:$0

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808-AG11D-LF Information

Specifications
Comparison
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Product attributes: Attribute value

Manufacturer:: TE Connectivity AMP Connectors

Series:: 800

Packaging:: Tube

Product Status:: Obsolete

Type:: DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):: 8 (2 x 4)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 25.0µin (0.63µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 25.0µin (0.63µm)

Contact Material - Post:: Copper

Housing Material:: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Operating Temperature:: -55°C ~ 105°C

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Part Number	808-AG11D-LF	808-AG10D	8080-1G1	8080-1G15	8080-1G24
Manufacturer	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors
Series	800	800	8080	8080	-
Packaging	Tube	Tube	Bulk	Bulk	Bulk
Product Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	Transistor, TO-3	Transistor, TO-3	Transistor, TO-3
Number of Positions or Pins (Grid)	8 (2 x 4)	8 (2 x 4)	4 (Round)	3 (Oval)	3 (Round)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	-	-	-
Contact Finish - Mating	Gold	Gold	Tin-Lead	Tin-Lead	Tin-Lead
Contact Finish Thickness - Mating	25.0µin (0.63µm)	25.0µin (0.63µm)	-	200.0µin (5.08µm)	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper	Copper Alloy	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Chassis Mount	Chassis Mount
Features	Open Frame	Open Frame	Closed Frame	Closed Frame	Closed Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	-	-	-
Contact Finish - Post	Gold	Gold	Tin-Lead	Tin-Lead	Tin-Lead
Contact Finish Thickness - Post	25.0µin (0.63µm)	5.00µin (0.127µm)	-	200.0µin (5.08µm)	20.0µin (0.51µm)
Contact Material - Post	Copper	Copper Alloy	Beryllium Copper	Beryllium Copper	Beryllium Copper
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polyester	Fluoropolymer (FP)	Fluoropolymer (FP)	Diallyl Phthalate (DAP)
Operating Temperature	-55°C ~ 105°C	-55°C ~ 105°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C