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Mill-Max Manufacturing Corp. 614-93-318-31-012000

Part No.:
614-93-318-31-012000
Manufacturer:
Mill-Max Manufacturing Corp.
Category:
IC Sockets
Package:
Description:
CONN IC DIP SOCKET 18POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
Shipping

614-93-318-31-012000 Information

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Manufacturer:
Mill-Max Manufacturing Corp.
Series:
614
Packaging:
Tube
Product Status:
Active
Type:
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):
18 (2 x 9)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
30.0µin (0.76µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Carrier, Open Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin-Lead
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass Alloy
Housing Material:
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:
-55°C ~ 125°C
Image 614-93-308-31-012000 614-43-308-31-012000 614-43-314-31-012000 614-43-316-31-012000 614-93-318-31-012000
Part Number 614-93-308-31-012000 614-43-308-31-012000 614-43-314-31-012000 614-43-316-31-012000 614-93-318-31-012000
Manufacturer Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp.
Series 614 614 614 614 614
Packaging Tube Tube Tube Tube Tube
Product Status Active Active Active Active Active
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4) 8 (2 x 4) 14 (2 x 7) 16 (2 x 8) 18 (2 x 9)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
Features Carrier, Open Frame Carrier, Open Frame Carrier, Open Frame Carrier, Open Frame Carrier, Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin-Lead Tin Tin Tin Tin-Lead
Contact Finish Thickness - Post 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm)
Contact Material - Post Brass Alloy Brass Alloy Brass Alloy Brass Alloy Brass Alloy
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C
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