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Mill-Max Manufacturing Corp. 614-13-072-11-042001

Name: 614-13-072-11-042001
Brand: Mill-Max Manufacturing Corp.
SKU: 614-13-072-11-042001
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 614-13-072-11-042001

Manufacturer:: Mill-Max Manufacturing Corp.

Category:: IC Sockets

Package:

Description:: SKT CARRIER PGA

Quantity:: Add To Cart Add To RFQ list

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614-13-072-11-042001 Information

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Product attributes: Attribute value

Manufacturer:: Mill-Max Manufacturing Corp.

Series:: 614

Packaging:: Bulk

Product Status:: Active

Type:: PGA

Number of Positions or Pins (Grid):: 72 (11 x 11)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 30.0µin (0.76µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Carrier, Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 10.0µin (0.25µm)

Contact Material - Post:: Brass Alloy

Housing Material:: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Operating Temperature:: -55°C ~ 125°C

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Part Number	614-93-308-31-012000	614-43-308-31-012000	614-43-314-31-012000	614-43-316-31-012000	614-93-318-31-012000
Manufacturer	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.
Series	614	614	614	614	614
Packaging	Tube	Tube	Tube	Tube	Tube
Product Status	Active	Active	Active	Active	Active
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)	8 (2 x 4)	14 (2 x 7)	16 (2 x 8)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Carrier, Open Frame	Carrier, Open Frame	Carrier, Open Frame	Carrier, Open Frame	Carrier, Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead	Tin	Tin	Tin	Tin-Lead
Contact Finish Thickness - Post	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)
Contact Material - Post	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C