Preci-Dip 558-10-560M33-001104

Product attributes

Attribute value

Manufacturer:

Preci-Dip

Series:

558

Packaging:

Bulk

Product Status:

Active

Type:

BGA

Number of Positions or Pins (Grid):

560 (33 x 33)

Pitch - Mating:

0.050" (1.27mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

10.0µin (0.25µm)

Contact Material - Mating:

Brass

Mounting Type:

Surface Mount

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.050" (1.27mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

10.0µin (0.25µm)

Contact Material - Post:

Brass

Housing Material:

FR4 Epoxy Glass

Operating Temperature:

-55°C ~ 125°C