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Mill-Max Manufacturing Corp. 511-91-064-08-000003

Part No.:
511-91-064-08-000003
Manufacturer:
Mill-Max Manufacturing Corp.
Category:
IC Sockets
Package:
Description:
SKT PGA SOLDRTL
Quantity:

Unit Price:$0

Ext Price:$0

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511-91-064-08-000003 Information

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Manufacturer:
Mill-Max Manufacturing Corp.
Series:
511
Packaging:
Bulk
Product Status:
Active
Type:
PGA
Number of Positions or Pins (Grid):
64 (8 x 8)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Closed Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin-Lead
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass Alloy
Housing Material:
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:
-55°C ~ 125°C
Image 511-13-059-11-001001 511-13-149-15-063003 511-13-299-20-096003 511-13-400-20-000001 511-91-032-09-041002
Part Number 511-13-059-11-001001 511-13-149-15-063003 511-13-299-20-096003 511-13-400-20-000001 511-91-032-09-041002
Manufacturer Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp.
Series 511 511 511 511 511
Packaging Bulk Bulk Tube Bulk Bulk
Product Status Active Active Active Active Active
Type PGA PGA PGA PGA PGA
Number of Positions or Pins (Grid) 59 (11 x 11) 149 (15 x 15) 299 (20 x 20) 400 (20 x 20) 32 (9 x 9)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
Features Open Frame Open Frame Open Frame Closed Frame Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold Gold Tin-Lead
Contact Finish Thickness - Post 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 200.0µin (5.08µm)
Contact Material - Post Brass Alloy Brass Alloy Brass Alloy Brass Alloy Brass Alloy
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C
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