Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

Mill-Max Manufacturing Corp. 511-13-149-15-063003

Name: 511-13-149-15-063003
Brand: Mill-Max Manufacturing Corp.
SKU: 511-13-149-15-063003
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 511-13-149-15-063003

Manufacturer:: Mill-Max Manufacturing Corp.

Category:: IC Sockets

Package:

Description:: SKT PGA SOLDRTL

Quantity:: Add To Cart Add To RFQ list

Unit Price:$0

Ext Price:$0

Payment:

Shipping:

511-13-149-15-063003 Information

Specifications
Comparison
Tags

Product attributes: Attribute value

Manufacturer:: Mill-Max Manufacturing Corp.

Series:: 511

Packaging:: Bulk

Product Status:: Active

Type:: PGA

Number of Positions or Pins (Grid):: 149 (15 x 15)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 30.0µin (0.76µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 10.0µin (0.25µm)

Contact Material - Post:: Brass Alloy

Housing Material:: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Operating Temperature:: -55°C ~ 125°C

Image
Part Number	511-13-059-11-001001	511-13-149-15-063003	511-13-299-20-096003	511-13-400-20-000001	511-91-032-09-041002
Manufacturer	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.	Mill-Max Manufacturing Corp.
Series	511	511	511	511	511
Packaging	Bulk	Bulk	Tube	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	PGA	PGA	PGA	PGA	PGA
Number of Positions or Pins (Grid)	59 (11 x 11)	149 (15 x 15)	299 (20 x 20)	400 (20 x 20)	32 (9 x 9)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Closed Frame	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Gold	Gold	Gold	Gold	Tin-Lead
Contact Finish Thickness - Post	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	200.0µin (5.08µm)
Contact Material - Post	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C