Aries Electronics 40-6554-18

Product attributes

Attribute value

Manufacturer:

Aries Electronics

Series:

55

Packaging:

Bulk

Product Status:

Active

Type:

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

Number of Positions or Pins (Grid):

40 (2 x 20)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Nickel Boron

Contact Finish Thickness - Mating:

50.0µin (1.27µm)

Contact Material - Mating:

Beryllium Nickel

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Nickel Boron

Contact Finish Thickness - Post:

50.0µin (1.27µm)

Contact Material - Post:

Beryllium Nickel

Housing Material:

Polyetheretherketone (PEEK), Glass Filled

Operating Temperature:

-55°C ~ 250°C