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Aries Electronics 40-0518-11

Name: 40-0518-11
Brand: Aries Electronics
SKU: 40-0518-11
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 40-0518-11

Manufacturer:: Aries Electronics

Category:: IC Sockets

Package:

Description:: CONN SOCKET SIP 40POS GOLD

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40-0518-11 Information

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Product attributes: Attribute value

Manufacturer:: Aries Electronics

Series:: 518

Packaging:: Bulk

Product Status:: Active

Type:: SIP

Number of Positions or Pins (Grid):: 40 (1 x 40)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 10.0µin (0.25µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 10.0µin (0.25µm)

Contact Material - Post:: Brass

Housing Material:: Polyamide (PA46), Nylon 4/6, Glass Filled

Operating Temperature:: -

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Part Number	40-0518-10	40-6518-10	40-C212-10	40-6823-90	40-0518-11
Manufacturer	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics
Series	518	518	EJECT-A-DIP™	Vertisockets™ 800	518
Packaging	Bulk	Bulk	Bulk	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	SIP	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	SIP
Number of Positions or Pins (Grid)	40 (1 x 40)	40 (2 x 20)	40 (2 x 20)	40 (2 x 20)	40 (1 x 40)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Phosphor Bronze	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole, Right Angle, Horizontal	Through Hole
Features	Open Frame	Open Frame	Closed Frame	Closed Frame	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Tin	Tin	Tin	Gold	Gold
Contact Finish Thickness - Post	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	10.0µin (0.25µm)	10.0µin (0.25µm)
Contact Material - Post	Brass	Brass	Brass	Phosphor Bronze	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyamide (PA46), Nylon 4/6	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-	-	-55°C ~ 105°C	-	-