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Aries Electronics 35-0518-10H

Part No.:
35-0518-10H
Manufacturer:
Aries Electronics
Category:
IC Sockets
Package:
Description:
CONN SOCKET SIP 35POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

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35-0518-10H Information

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Attribute value
Manufacturer:
Aries Electronics
Series:
518
Packaging:
Bulk
Product Status:
Active
Type:
SIP
Number of Positions or Pins (Grid):
35 (1 x 35)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Open Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass
Housing Material:
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:
-
Image 35-0518-10 35-0518-10T 35-0518-10H 35-0518-11 35-0518-00
Part Number 35-0518-10 35-0518-10T 35-0518-10H 35-0518-11 35-0518-00
Manufacturer Aries Electronics Aries Electronics Aries Electronics Aries Electronics Aries Electronics
Series 518 518 518 518 518
Packaging Bulk Bulk Bulk Bulk Bulk
Product Status Active Active Active Active Active
Type SIP SIP SIP SIP SIP
Number of Positions or Pins (Grid) 35 (1 x 35) 35 (1 x 35) 35 (1 x 35) 35 (1 x 35) 35 (1 x 35)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Surface Mount
Features Open Frame Open Frame Open Frame Open Frame Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Tin Tin Gold Tin
Contact Finish Thickness - Post 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm) 10.0µin (0.25µm) 200.0µin (5.08µm)
Contact Material - Post Brass Brass Brass Brass Brass
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature - - - - -
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