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Aries Electronics 32-6518-10

Part No.:
32-6518-10
Manufacturer:
Aries Electronics
Category:
IC Sockets
Package:
Datasheet:
32-6518-10.pdf
Description:
CONN IC DIP SOCKET 32POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

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Payment
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32-6518-10 Information

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Product attributes
Attribute value
Manufacturer:
Aries Electronics
Series:
518
Packaging:
Tube
Product Status:
Active
Type:
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):
32 (2 x 16)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Open Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass
Housing Material:
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:
-
Image 32-6554-10 32-6554-11 32-6518-10 32-C182-10 32-6518-10T
Part Number 32-6554-10 32-6554-11 32-6518-10 32-C182-10 32-6518-10T
Manufacturer Aries Electronics Aries Electronics Aries Electronics Aries Electronics Aries Electronics
Series 55 55 518 EJECT-A-DIP™ 518
Packaging Bulk Tube Tube Bulk Bulk
Product Status Active Active Active Active Active
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 32 (2 x 16) 32 (2 x 16) 32 (2 x 16) 32 (2 x 16) 32 (2 x 16)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Tin Gold Gold Gold Gold
Contact Finish Thickness - Mating 200.0µin (5.08µm) - 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Open Frame Closed Frame Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Gold Tin Tin Tin
Contact Finish Thickness - Post 200.0µin (5.08µm) - 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm)
Contact Material - Post Beryllium Copper Beryllium Copper Brass Brass Brass
Housing Material Polyphenylene Sulfide (PPS), Glass Filled Polyphenylene Sulfide (PPS), Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature - - - -55°C ~ 105°C -
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