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Aries Electronics 28-516-11

Name: 28-516-11
Brand: Aries Electronics
SKU: 28-516-11
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 28-516-11

Manufacturer:: Aries Electronics

Category:: IC Sockets

Package:

Datasheet:: 28-516-11.pdf

Description:: CONN IC DIP SOCKET ZIF 28POS GLD

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28-516-11 Information

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Product attributes: Attribute value

Manufacturer:: Aries Electronics

Series:: 516

Packaging:: Bulk

Product Status:: Active

Type:: DIP, ZIF (ZIP)

Number of Positions or Pins (Grid):: 28 (2 x 14)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 10.0µin (0.25µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Closed Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 10.0µin (0.25µm)

Contact Material - Post:: Beryllium Copper

Housing Material:: Polyamide (PA46), Nylon 4/6, Glass Filled

Operating Temperature:: -

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Part Number	28-6554-11	289-PRS17001-12	28-526-10	28-6554-10	28-516-11
Manufacturer	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics
Series	55	PRS	Lo-PRO®file, 526	55	516
Packaging	Bulk	Bulk	Bulk	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	PGA, ZIF (ZIP)	DIP, ZIF (ZIP)	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	28 (2 x 14)	-	28 (2 x 14)	28 (2 x 14)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Tin	Tin	Gold
Contact Finish Thickness - Mating	-	30.0µin (0.76µm)	10.0µin (0.25µm)	200.0µin (5.08µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Closed Frame	Closed Frame	Closed Frame	Closed Frame	Closed Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Gold	Tin	Tin	Tin	Gold
Contact Finish Thickness - Post	-	200.0µin (5.08µm)	10.0µin (0.25µm)	200.0µin (5.08µm)	10.0µin (0.25µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled	Polyphenylene Sulfide (PPS)	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyphenylene Sulfide (PPS), Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-	-65°C ~ 125°C	-55°C ~ 105°C	-	-