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3M 268-5401-11-1102JH

Part No.:
268-5401-11-1102JH
Manufacturer:
3M
Category:
IC Sockets
Package:
Description:
CONN SOCKET CLCC 68POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
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Shipping:
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268-5401-11-1102JH Information

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Product attributes
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Manufacturer:
3M
Series:
OEM
Packaging:
Bulk
Product Status:
Obsolete
Type:
CLCC
Number of Positions or Pins (Grid):
68 (4 x 17)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
30.0µin (0.76µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Closed Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
30.0µin (0.76µm)
Contact Material - Post:
Beryllium Copper
Housing Material:
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:
-55°C ~ 105°C
Image 268-5401-50-1102JH 268-5401-11-1102JH 268-5401-52-1102JH 268-5401-50-1102 268-5401-00-1102JH
Part Number 268-5401-50-1102JH 268-5401-11-1102JH 268-5401-52-1102JH 268-5401-50-1102 268-5401-00-1102JH
Manufacturer 3M 3M 3M 3M 3M
Series OEM OEM OEM Textool™ OEM
Packaging Bulk Bulk Bulk Bulk Tray
Product Status Obsolete Obsolete Obsolete Obsolete Obsolete
Type CLCC CLCC CLCC - CLCC
Number of Positions or Pins (Grid) 68 (4 x 17) 68 (4 x 17) 68 (4 x 17) - 68 (4 x 17)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) - 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold - Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) - 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper - Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole - Through Hole
Features Closed Frame Closed Frame Closed Frame - Closed Frame
Termination Solder Solder Solder - Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) - 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold - Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) - 30.0µin (0.76µm)
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper - Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled Polyphenylene Sulfide (PPS), Glass Filled Polyphenylene Sulfide (PPS), Glass Filled - Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -55°C ~ 105°C -55°C ~ 105°C -55°C ~ 105°C - -55°C ~ 105°C
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