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| Part Number | 264-4493-00-0602J | 264-1300-00-0602J | 264-5205-01 | 264-4205-00 |
| Manufacturer | 3M | 3M | 3M | 3M |
| Series | Textool™ | Textool™ | Textool™ | Textool™ |
| Packaging | Tube | Tube | Bulk | Box |
| Product Status | Active | Active | Active | Active |
| Type | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | QFN | - |
| Number of Positions or Pins (Grid) | 64 (2 x 32) | 64 (2 x 32) | 64 (4 x 16) | - |
| Pitch - Mating | 0.100" (2.54mm) | 0.070" (1.78mm) | 0.020" (0.50mm) | - |
| Contact Finish - Mating | Gold | Gold | Gold | - |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | 30.0µin (0.76µm) | - | - |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | - |
| Mounting Type | Connector | Connector | Through Hole | - |
| Features | Closed Frame | Closed Frame | Open Frame | - |
| Termination | Press-Fit | Press-Fit | Solder | - |
| Pitch - Post | 0.100" (2.54mm) | 0.070" (1.78mm) | 0.020" (0.50mm) | - |
| Contact Finish - Post | Gold | Gold | Gold | - |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) | 30.0µin (0.76µm) | - | - |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | Beryllium Copper | - |
| Housing Material | Polysulfone (PSU), Glass Filled | Polysulfone (PSU), Glass Filled | Polyethersulfone (PES) | - |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | - | - |
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