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3M 256-6313-9UA-1902
- Part No.:
- 256-6313-9UA-1902
- Manufacturer:
- 3M
- Category:
- IC Sockets
- Package:
- Description:
- PGA 13 X 13
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
256-6313-9UA-1902 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- 3M
- Series:
- Textool™
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid):
- 56 (13 x 13)
- Pitch - Mating:
- 0.100" (2.54mm)
- Contact Finish - Mating:
- Gold
- Contact Finish Thickness - Mating:
- 30.0µin (0.76µm)
- Contact Material - Mating:
- Beryllium Copper
- Mounting Type:
- Through Hole
- Features:
- Closed Frame
- Termination:
- Solder
- Pitch - Post:
- 0.100" (2.54mm)
- Contact Finish - Post:
- Gold
- Contact Finish Thickness - Post:
- 30.0µin (0.76µm)
- Contact Material - Post:
- Beryllium Copper
- Housing Material:
- Polyethersulfone (PES)
- Operating Temperature:
- -55°C ~ 150°C
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| Part Number | 256-4205-01 | 256-1292-00-0602J | 256-5205-01 | 256-6313-9UA-1902 |
| Manufacturer | 3M | 3M | 3M | 3M |
| Series | Textool™ | Textool™ | Textool™ | Textool™ |
| Packaging | Bulk | Bulk | Bulk | Bulk |
| Product Status | Active | Active | Active | Obsolete |
| Type | QFN | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 56 (4 x 14) | 56 (2 x 28) | - | 56 (13 x 13) |
| Pitch - Mating | 0.016" (0.40mm) | 0.070" (1.78mm) | - | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | - | Gold |
| Contact Finish Thickness - Mating | - | 30.0µin (0.76µm) | - | 30.0µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | - | Beryllium Copper |
| Mounting Type | Through Hole | Connector | - | Through Hole |
| Features | Open Frame | Closed Frame | - | Closed Frame |
| Termination | Solder | Press-Fit | - | Solder |
| Pitch - Post | 0.016" (0.40mm) | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish - Post | Gold | Gold | - | Gold |
| Contact Finish Thickness - Post | - | 30.0µin (0.76µm) | - | 30.0µin (0.76µm) |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | - | Beryllium Copper |
| Housing Material | Polyethersulfone (PES) | Polysulfone (PSU), Glass Filled | - | Polyethersulfone (PES) |
| Operating Temperature | - | -55°C ~ 125°C | - | -55°C ~ 150°C |
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