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3M 248-4205-01

Part No.:
248-4205-01
Manufacturer:
3M
Category:
IC Sockets
Package:
Description:
CONN SOCKET QFN 48POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
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248-4205-01 Information

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Product attributes
Attribute value
Manufacturer:
3M
Series:
Textool™
Packaging:
Bulk
Product Status:
Active
Type:
QFN
Number of Positions or Pins (Grid):
48 (4 x 12)
Pitch - Mating:
0.016" (0.40mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
-
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Closed Frame
Termination:
Solder
Pitch - Post:
-
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
-
Contact Material - Post:
Beryllium Copper
Housing Material:
Polyethersulfone (PES)
Operating Temperature:
-
Image 248-1282-00-0602J 248-5205-01 248-5205-00 248-4205-01
Part Number 248-1282-00-0602J 248-5205-01 248-5205-00 248-4205-01
Manufacturer 3M 3M 3M 3M
Series Textool™ Textool™ Textool™ Textool™
Packaging Tube Bulk Bulk Bulk
Product Status Active Active Active Active
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing QFN QFN QFN
Number of Positions or Pins (Grid) 48 (2 x 24) 48 (4 x 12) 48 (4 x 12) 48 (4 x 12)
Pitch - Mating 0.100" (2.54mm) 0.020" (0.50mm) 0.020" (0.50mm) 0.016" (0.40mm)
Contact Finish - Mating Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) - - -
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Connector Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Closed Frame
Termination Press-Fit Solder Solder Solder
Pitch - Post 0.100" (2.54mm) - - -
Contact Finish - Post Gold Gold Gold Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) - - -
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Polysulfone (PSU), Glass Filled Polyethersulfone (PES) Polyethersulfone (PES) Polyethersulfone (PES)
Operating Temperature -55°C ~ 125°C - - -
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