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Aries Electronics 24-3518-10

Name: 24-3518-10
Brand: Aries Electronics
SKU: 24-3518-10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 24-3518-10

Manufacturer:: Aries Electronics

Category:: IC Sockets

Package:

Datasheet:: 24-3518-10.pdf

Description:: CONN IC DIP SOCKET 24POS GOLD

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Unit Price:$0

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24-3518-10 Information

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Product attributes: Attribute value

Manufacturer:: Aries Electronics

Series:: 518

Packaging:: Bulk

Product Status:: Active

Type:: DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):: 24 (2 x 12)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 10.0µin (0.25µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Tin

Contact Finish Thickness - Post:: 200.0µin (5.08µm)

Contact Material - Post:: Brass

Housing Material:: Polyamide (PA46), Nylon 4/6, Glass Filled

Operating Temperature:: -

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Part Number	24-3518-10	24-6518-10	24-4518-10	24-6554-16	24-526-10
Manufacturer	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics	Aries Electronics
Series	518	518	518	55	Lo-PRO®file, 526
Packaging	Bulk	Tube	Bulk	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.4" (10.16mm) Row Spacing	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Nickel Boron	Tin
Contact Finish Thickness - Mating	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	50.0µin (1.27µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Closed Frame	Closed Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Tin	Tin	Tin	Nickel Boron	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	50.0µin (1.27µm)	10.0µin (0.25µm)
Contact Material - Post	Brass	Brass	Brass	Beryllium Copper	Beryllium Copper
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled	Polyphenylene Sulfide (PPS), Glass Filled	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-	-	-	-	-55°C ~ 105°C