TMS International Tech(HK) Limited Hello! now TMS International Tech(HK) Limitedtms@lcdchip.com
Follow us :

Aries Electronics 225-PGM15001-10

Part No.:
225-PGM15001-10
Manufacturer:
Aries Electronics
Category:
IC Sockets
Package:
Description:
CONN SOCKET PGA GOLD
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
Shipping

225-PGM15001-10 Information

  • Specifications
  • Comparison
  • Tags
Product attributes
Attribute value
Manufacturer:
Aries Electronics
Series:
PGM
Packaging:
Bulk
Product Status:
Active
Type:
PGA
Number of Positions or Pins (Grid):
-
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
-
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass
Housing Material:
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:
-55°C ~ 105°C
Image 225-PRS15001-12 225-PGM15001-10 225-PGM15001-11 225-PGM15001-51 225-PLS18003-12
Part Number 225-PRS15001-12 225-PGM15001-10 225-PGM15001-11 225-PGM15001-51 225-PLS18003-12
Manufacturer Aries Electronics Aries Electronics Aries Electronics Aries Electronics Aries Electronics
Series PRS PGM PGM PGM PLS
Packaging Bulk Bulk Bulk Bulk -
Product Status Active Active Active Active Active
Type PGA, ZIF (ZIP) PGA PGA PGA PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) 225 (15 x 15) - - - 225 (15 x 15)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
Features Closed Frame - - - Closed Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Tin Gold Gold Tin
Contact Finish Thickness - Post 200.0µin (5.08µm) 200.0µin (5.08µm) 10.0µin (0.25µm) 10.0µin (0.25µm) 200.0µin (5.08µm)
Contact Material - Post Beryllium Copper Brass Brass Brass Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS) Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyphenylene Sulfide (PPS)
Operating Temperature -65°C ~ 125°C -55°C ~ 105°C -55°C ~ 125°C -55°C ~ 125°C -
  • 225-PGM15001-10
  • 225-PGM15001-10 PDF
  • 225-PGM15001-10 Datasheet
  • 225-PGM15001-10 Specifications
  • 225-PGM15001-10 Images
  • Aries Electronics
  • Aries Electronics 225-PGM15001-10
  • Buy 225-PGM15001-10
  • 225-PGM15001-10 Price
  • 225-PGM15001-10 Distributor
  • 225-PGM15001-10 Supplier
  • 225-PGM15001-10 Wholesale
  • Include Parts
  • Popular Search

The following parts include "225-PGM15001-10" in Silicon Labs 225-PGM15001-10.

  • Part Number
  • Manufacturer
  • Package
  • Description

Inventory:3,571

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity
Country
Name
Company
Email
Comments

In Stock:3,571

Qty. Unit Price Ext. Price
RFQ now Add to RFQ List
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
TMS International Tech(HK) Limited
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER