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| Part Number | 225-PRS15001-12 | 225-PGM15001-10 | 225-PGM15001-11 | 225-PGM15001-51 | 225-PLS18003-12 |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics | Aries Electronics | Aries Electronics |
| Series | PRS | PGM | PGM | PGM | PLS |
| Packaging | Bulk | Bulk | Bulk | Bulk | - |
| Product Status | Active | Active | Active | Active | Active |
| Type | PGA, ZIF (ZIP) | PGA | PGA | PGA | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 225 (15 x 15) | - | - | - | 225 (15 x 15) |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 30.0µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole |
| Features | Closed Frame | - | - | - | Closed Frame |
| Termination | Solder | Solder | Solder | Solder | Solder |
| Pitch - Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Post | Tin | Tin | Gold | Gold | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) | 200.0µin (5.08µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 200.0µin (5.08µm) |
| Contact Material - Post | Beryllium Copper | Brass | Brass | Brass | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS) | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS) |
| Operating Temperature | -65°C ~ 125°C | -55°C ~ 105°C | -55°C ~ 125°C | -55°C ~ 125°C | - |
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