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3M 224-5809-00-0602

Part No.:
224-5809-00-0602
Manufacturer:
3M
Category:
IC Sockets
Package:
Description:
CONN SOCKET SIP ZIF 24POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
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Shipping:
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224-5809-00-0602 Information

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Product attributes
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Manufacturer:
3M
Series:
Textool™
Packaging:
Bulk
Product Status:
Active
Type:
SIP, ZIF (ZIP)
Number of Positions or Pins (Grid):
24 (1 x 24)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
-
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
-
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
30.0µin (0.76µm)
Contact Material - Post:
Beryllium Copper
Housing Material:
Polysulfone (PSU), Glass Filled
Operating Temperature:
-55°C ~ 125°C
Image 224-1275-00-0602J 224-5809-00-0602 224-5205-01 224-7397-55-1902 224-1286-00-0602J
Part Number 224-1275-00-0602J 224-5809-00-0602 224-5205-01 224-7397-55-1902 224-1286-00-0602J
Manufacturer 3M 3M 3M 3M 3M
Series Textool™ Textool™ Textool™ Textool™ Textool™
Packaging Tube Bulk Bulk Bulk Tube
Product Status Active Active Active Active Active
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing SIP, ZIF (ZIP) QFN SOIC DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12) 24 (1 x 24) 24 (4x4) 24 (2 x 12) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.020" (0.50mm) - 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) - - - 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Connector Through Hole Through Hole Through Hole Connector
Features Closed Frame - - Closed Frame Closed Frame
Termination Press-Fit Solder Solder Solder Press-Fit
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) - - 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold Gold Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) 30.0µin (0.76µm) - 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Polysulfone (PSU), Glass Filled Polysulfone (PSU), Glass Filled Polyethersulfone (PES) Polyethersulfone (PES), Glass Filled Polysulfone (PSU), Glass Filled
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C - -55°C ~ 150°C -55°C ~ 125°C
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