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TE Connectivity AMP Connectors 2-2129710-6

Name: 2-2129710-6
Brand: TE Connectivity AMP Connectors
SKU: 2-2129710-6
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 2-2129710-6

Manufacturer:: TE Connectivity AMP Connectors

Category:: IC Sockets

Package:

Datasheet:: 2-2129710-6.pdf

Description:: CONN SOCKET LGA 3647POS GOLD

Quantity:: Add To Cart Add To RFQ list

Unit Price:$0

Ext Price:$0

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2-2129710-6 Information

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Product attributes: Attribute value

Manufacturer:: TE Connectivity AMP Connectors

Series:: -

Packaging:: Tray

Product Status:: Last Time Buy

Type:: LGA

Number of Positions or Pins (Grid):: 3647

Pitch - Mating:: -

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 30.0µin (0.76µm)

Contact Material - Mating:: Copper Alloy

Mounting Type:: Surface Mount

Features:: Open Frame

Termination:: Solder

Pitch - Post:: -

Contact Finish - Post:: -

Contact Finish Thickness - Post:: -

Contact Material - Post:: Copper Alloy

Housing Material:: Thermoplastic

Operating Temperature:: -

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Part Number	2485264-1	2041549-1	2350616-1	2-2129710-5	2-2129710-6
Manufacturer	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors	TE Connectivity AMP Connectors
Series	-	DMD	-	-	-
Packaging	Tube	Tape & Reel (TR)	Tray	Tray	Tray
Product Status	Active	Active	Active	Last Time Buy	Last Time Buy
Type	DIP, 0.3" (7.62mm) Row Spacing	PGA, ZIF (ZIP)	LGA	LGA	LGA
Number of Positions or Pins (Grid)	8	350 (35 x 36)	250 (16 x 25)	3647	3647
Pitch - Mating	0.100" (2.54mm)	0.050" (1.27mm)	0.039" (1.00mm)	-	-
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	Flash	Flash	3.00µin (0.076µm)	30.0µin (0.76µm)	30.0µin (0.76µm)
Contact Material - Mating	Copper Alloy	Copper Alloy	Copper Alloy	Copper Alloy	Copper Alloy
Mounting Type	Through Hole	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Features	Open Frame	Closed Frame	Board Guide, Open Frame	Open Frame	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.050" (1.27mm)	-	-	-
Contact Finish - Post	Tin	Tin-Lead	-	-	-
Contact Finish Thickness - Post	78.7µin (2.00µm)	-	-	-	-
Contact Material - Post	Copper Alloy	Copper Alloy	-	Copper Alloy	Copper Alloy
Housing Material	Thermoplastic	Liquid Crystal Polymer (LCP), Glass Filled	Thermoplastic	Thermoplastic	Thermoplastic
Operating Temperature	-55°C ~ 125°C	-55°C ~ 105°C	-25°C ~ 100°C	-	-