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3M 216-6278-00-3303
- Part No.:
- 216-6278-00-3303
- Manufacturer:
- 3M
- Category:
- IC Sockets
- Package:
- Datasheet:
-
216-6278-00-3303.pdf
- Description:
- CONN IC DIP SOCKET ZIF 16POS GLD
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
216-6278-00-3303 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- 3M
- Series:
- OEM
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):
- 16 (2 x 8)
- Pitch - Mating:
- 0.100" (2.54mm)
- Contact Finish - Mating:
- Gold
- Contact Finish Thickness - Mating:
- 250.0µin (6.35µm)
- Contact Material - Mating:
- Beryllium Copper
- Mounting Type:
- Through Hole
- Features:
- Closed Frame
- Termination:
- Solder
- Pitch - Post:
- 0.100" (2.54mm)
- Contact Finish - Post:
- Gold
- Contact Finish Thickness - Post:
- 250.0µin (6.35µm)
- Contact Material - Post:
- Beryllium Copper
- Housing Material:
- Polyether Imide (PEI), Glass Filled
- Operating Temperature:
- -55°C ~ 105°C
| Image |  |
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| Part Number | 216-3340-00-0602J | 216-7224-55-1902 | 216-7383-55-1902 | 216-5205-01 | 216-6278-00-3303 |
| Manufacturer | 3M | 3M | 3M | 3M | 3M |
| Series | Textool™ | Textool™ | Textool™ | Textool™ | OEM |
| Packaging | Tube | Bulk | Bulk | Bulk | Tube |
| Product Status | Active | Active | Active | Active | Obsolete |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | SOIC | SOIC | QFN | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 16 (2 x 8) | 16 (2 x 8) | 16 (2 x 8) | 16 (3x3) | 16 (2 x 8) |
| Pitch - Mating | 0.100" (2.54mm) | - | - | 0.020" (0.50mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | - | - | - | 250.0µin (6.35µm) |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Mounting Type | Connector | Through Hole | Through Hole | Through Hole | Through Hole |
| Features | Closed Frame | Closed Frame | Closed Frame | - | Closed Frame |
| Termination | Press-Fit | Solder | Solder | Solder | Solder |
| Pitch - Post | 0.100" (2.54mm) | - | - | - | 0.100" (2.54mm) |
| Contact Finish - Post | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) | 30.0µin (0.76µm) | 30.0µin (0.76µm) | - | 250.0µin (6.35µm) |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Housing Material | Polysulfone (PSU), Glass Filled | Polyethersulfone (PES), Glass Filled | Polyethersulfone (PES), Glass Filled | Polyethersulfone (PES) | Polyether Imide (PEI), Glass Filled |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 150°C | -55°C ~ 150°C | - | -55°C ~ 105°C |
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