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TE Connectivity AMP Connectors 2-1571550-7
- Part No.:
- 2-1571550-7
- Manufacturer:
- TE Connectivity AMP Connectors
- Category:
- IC Sockets
- Package:
- Description:
- CONN IC DIP SOCKET 22POS GOLD
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
2-1571550-7 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- TE Connectivity AMP Connectors
- Series:
- 500
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid):
- 22 (2 x 11)
- Pitch - Mating:
- 0.100" (2.54mm)
- Contact Finish - Mating:
- Gold
- Contact Finish Thickness - Mating:
- 25.0µin (0.63µm)
- Contact Material - Mating:
- Beryllium Copper
- Mounting Type:
- Through Hole
- Features:
- Closed Frame
- Termination:
- Solder
- Pitch - Post:
- 0.100" (2.54mm)
- Contact Finish - Post:
- Gold
- Contact Finish Thickness - Post:
- 25.0µin (0.63µm)
- Contact Material - Post:
- Beryllium Copper
- Housing Material:
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature:
- -55°C ~ 125°C
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| Part Number | 2485264-1 | 2041549-1 | 2350616-1 | 2-2129710-5 | 2-2129710-6 |
| Manufacturer | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors |
| Series | - | DMD | - | - | - |
| Packaging | Tube | Tape & Reel (TR) | Tray | Tray | Tray |
| Product Status | Active | Active | Active | Last Time Buy | Last Time Buy |
| Type | DIP, 0.3" (7.62mm) Row Spacing | PGA, ZIF (ZIP) | LGA | LGA | LGA |
| Number of Positions or Pins (Grid) | 8 | 350 (35 x 36) | 250 (16 x 25) | 3647 | 3647 |
| Pitch - Mating | 0.100" (2.54mm) | 0.050" (1.27mm) | 0.039" (1.00mm) | - | - |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | Flash | Flash | 3.00µin (0.076µm) | 30.0µin (0.76µm) | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Features | Open Frame | Closed Frame | Board Guide, Open Frame | Open Frame | Open Frame |
| Termination | Solder | Solder | Solder | Solder | Solder |
| Pitch - Post | 0.100" (2.54mm) | 0.050" (1.27mm) | - | - | - |
| Contact Finish - Post | Tin | Tin-Lead | - | - | - |
| Contact Finish Thickness - Post | 78.7µin (2.00µm) | - | - | - | - |
| Contact Material - Post | Copper Alloy | Copper Alloy | - | Copper Alloy | Copper Alloy |
| Housing Material | Thermoplastic | Liquid Crystal Polymer (LCP), Glass Filled | Thermoplastic | Thermoplastic | Thermoplastic |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 105°C | -25°C ~ 100°C | - | - |
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