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3M 208-7391-55-1902
- Part No.:
- 208-7391-55-1902
- Manufacturer:
- 3M
- Category:
- IC Sockets
- Package:
- Description:
- CONN SOCKET SOIC 8POS GOLD
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
208-7391-55-1902 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- 3M
- Series:
- Textool™
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- SOIC
- Number of Positions or Pins (Grid):
- 8 (2 x 4)
- Pitch - Mating:
- -
- Contact Finish - Mating:
- Gold
- Contact Finish Thickness - Mating:
- 30.0µin (0.76µm)
- Contact Material - Mating:
- Beryllium Copper
- Mounting Type:
- Through Hole
- Features:
- Closed Frame
- Termination:
- Solder
- Pitch - Post:
- -
- Contact Finish - Post:
- Gold
- Contact Finish Thickness - Post:
- 30.0µin (0.76µm)
- Contact Material - Post:
- Beryllium Copper
- Housing Material:
- Polyethersulfone (PES), Glass Filled
- Operating Temperature:
- -55°C ~ 150°C
| Image |  |
| Part Number | 208-7391-55-1902 |
| Manufacturer | 3M |
| Series | Textool™ |
| Packaging | Bulk |
| Product Status | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Operating Temperature | -55°C ~ 150°C |
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