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Aries Electronics 18-3518-10

Part No.:
18-3518-10
Manufacturer:
Aries Electronics
Category:
IC Sockets
Package:
Datasheet:
18-3518-10.pdf
Description:
CONN IC DIP SOCKET 18POS GOLD
Quantity:

Unit Price:$0

Ext Price:$0

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18-3518-10 Information

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Product attributes
Attribute value
Manufacturer:
Aries Electronics
Series:
518
Packaging:
Tube
Product Status:
Active
Type:
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):
18 (2 x 9)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Open Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Tin
Contact Finish Thickness - Post:
200.0µin (5.08µm)
Contact Material - Post:
Brass
Housing Material:
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:
-
Image 18-3518-10 18-6513-10 18-6810-90T 18-1518-10 18-0518-10
Part Number 18-3518-10 18-6513-10 18-6810-90T 18-1518-10 18-0518-10
Manufacturer Aries Electronics Aries Electronics Aries Electronics Aries Electronics Aries Electronics
Series 518 Lo-PRO®file, 513 Vertisockets™ 800 518 518
Packaging Tube Tube Bulk Bulk Bulk
Product Status Active Active Active Active Active
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.2" (5.08mm) Row Spacing SIP
Number of Positions or Pins (Grid) 18 (2 x 9) 18 (2 x 9) 18 (2 x 9) 18 (2 x 9) 18 (1 x 18)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Tin Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 10.0µin (0.25µm) 200.0µin (5.08µm) 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Phosphor Bronze Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole, Right Angle, Vertical Through Hole Through Hole
Features Open Frame Closed Frame Closed Frame Open Frame Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Tin Tin Tin Tin Tin
Contact Finish Thickness - Post 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm) 200.0µin (5.08µm)
Contact Material - Post Brass Brass Phosphor Bronze Brass Brass
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6 Polyamide (PA46), Nylon 4/6, Glass Filled Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature - -55°C ~ 105°C - - -
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