Aries Electronics 168-PLS17011-12

Product attributes

Attribute value

Manufacturer:

Aries Electronics

Series:

PLS

Packaging:

Bulk

Product Status:

Active

Type:

PGA, ZIF (ZIP)

Number of Positions or Pins (Grid):

-

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

30.0µin (0.76µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Tin

Contact Finish Thickness - Post:

200.0µin (5.08µm)

Contact Material - Post:

Beryllium Copper

Housing Material:

Polyphenylene Sulfide (PPS)

Operating Temperature:

-65°C ~ 125°C