10018784-10210TLF.pdf
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| Part Number | 10018784-10210TLF | 10018784-10200TLF | 10018784-10201TLF | 10018784-10211TLF | 10018784-10213TLF |
| Manufacturer | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) |
| Series | HPCE® | HPCE® | HPCE® | HPCE® | HPCE® |
| Packaging | Tray | Tray | Tray | Tray | Tray |
| Product Status | Active | Active | Active | Active | Active |
| Card Type | PCI Express™ | PCI Express™ | PCI Express™ | PCI Express™ | PCI Express™ |
| Gender | Female | Female | Female | Female | Female |
| Number of Positions/Bay/Row | - | - | 11; 21 | 11; 21 | - |
| Number of Positions | 36 | 36 | 64 | 64 | 164 |
| Card Thickness | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) |
| Number of Rows | 2 | 2 | 2 | 2 | 2 |
| Pitch | 0.039" (1.00mm) | 0.039" (1.00mm) | 0.039" (1.00mm) | 0.039" (1.00mm) | 0.039" (1.00mm) |
| Read Out | Dual | Dual | Dual | Dual | Dual |
| Features | Board Guide, Locking Ramp | Board Guide, Locking Ramp | Board Guide, Locking Ramp | Board Guide, Locking Ramp | Board Guide, Locking Ramp |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole |
| Termination | Solder, Staggered | Solder, Staggered | Solder, Staggered | Solder, Staggered | Solder, Staggered |
| Contact Material | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy |
| Contact Finish | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness | Flash | Flash | Flash | Flash | Flash |
| Contact Type | Cantilever | Cantilever | Cantilever | Cantilever | Cantilever |
| Color | Black | Black | Black | Black | Black |
| Flange Feature | - | - | - | - | - |
| Operating Temperature | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 85°C |
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