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TETMX8MP-C NXP i.MX 8M Plus AI Vision Core Board with 2.3 TOPS NPU

2026/8/11 11:24:42

The Lcdchip TETMX8MP-C core board is designed around the NXP i.MX 8M Plus processor family, focusing on machine learning, vision processing, advanced multimedia and reliable industrial automation. With Cortex-A53 application cores, a Cortex-M7 real-time processor, an optional 2.3 TOPS NPU, ISP, camera input, high-speed Ethernet, USB 3.0, PCIe 3.0, CAN FD and rich multimedia interfaces, it is suitable for smart city, industrial IoT, intelligent medical, smart transportation and edge AI terminals.

Lcdchip TETMX8MP-C

Model	Processor	Frequency	RAM	ROM	Supported OS
TETMX8MPQ-C	NXP i.MX 8M Plus Quad	1.6GHz	1GB LPDDR4	8GB eMMC	Linux 5.4.70
TETMX8MPQ-C	NXP i.MX 8M Plus Quad	1.6GHz	2GB LPDDR4	16GB eMMC	Linux 5.4.70
TETMX8MPQ-C	NXP i.MX 8M Plus Quad	1.6GHz	4GB LPDDR4	16GB eMMC	Linux 5.4.70 / Android 11
TETMX8MPL-C	NXP i.MX 8M Plus QuadLite	1.6GHz	1GB LPDDR4	8GB eMMC	Linux 5.4.70
TETMX8MPL-C	NXP i.MX 8M Plus QuadLite	1.6GHz	2GB LPDDR4	16GB eMMC	Linux 5.4.70

Difference note: Compared with TETMX8MPQ-C, the TETMX8MPL-C version removes VPU, NPU, ISP and HiFi 4 DSP functions. The two versions remain compatible in software and hardware within the supported configuration range.

High-Speed Communication Interfaces

The TETMX8MP-C series integrates high-speed communication resources for edge gateways, industrial controllers, camera systems and AI-enabled terminals. It supports dual Gigabit Ethernet, USB 3.0, PCIe 3.0, SDIO 3.0 and CAN FD interfaces for demanding industrial and embedded applications.

2 × Ethernet
1Gbps

2 × USB 3.0

PCIe 3.0

2 × SDIO 3.0

2 × CAN FD

NXP i.MX 8M Plus Platform

The TETMX8MP-C series uses the NXP i.MX 8M Plus platform, combining Cortex-A53 application processing with a Cortex-M7 real-time core. It is suitable for edge devices requiring both application-level computing and deterministic control.

2.3 TOPS Edge AI Performance

The TETMX8MPQ-C version integrates an NPU with up to 2.3 TOPS of AI computing performance, helping accelerate lightweight machine-learning, visual-recognition and edge-inference workloads.

Built-in ISP and Camera Input

Integrated image-signal processing and dual camera input support enable efficient vision-system development for AI cameras, industrial inspection, video analytics and smart terminals.

Cortex-M7 Real-Time Control

The Cortex-M7 core can be used for real-time control tasks, allowing the platform to handle industrial I/O, motor control, timing-sensitive communication and low-latency device management.

Dual Gigabit Ethernet with TSN

The platform supports two RGMII Ethernet interfaces, with one interface supporting TSN. This makes the board suitable for industrial communication, edge gateways and time-sensitive network applications.

CAN FD Industrial Communication

Up to two CAN FD interfaces support high-speed communication for industrial automation, vehicle electronics, robotics, control systems and field-device connectivity.

4K Display and HiFi Voice Experience

The TETMX8MP-C series supports HDMI, LVDS and MIPI-DSI display interfaces. HDMI can support up to 4K display output, while LVDS and MIPI-DSI provide flexible LCD integration for embedded display devices. The TETMX8MPQ-C version also supports Cadence® Tensilica® HiFi 4 DSP at 800MHz, six SAI interfaces, IIS, TDM, AC97 and 8-channel PDM microphone input.

HDMI Up to 4Kp30 display output

LVDS Up to 1920 × 1200p60 with dual-channel configuration

MIPI-DSI Up to WQHD 2560 × 1440 with reduced blanking mode

Note: TETMX8MPL-C does not include the HiFi 4 DSP function. Display capability depends on carrier-board design, firmware, display timing and selected processor version.

Advanced Multimedia Technology

The TETMX8MPQ-C version supports hardware video encoding and decoding for edge multimedia applications. It supports 1080p60 H.264 and H.265 encoding, and 1080p60 VP8, VP9, H.264 and H.265 decoding, helping build efficient AI vision, video interaction and smart multimedia terminals.

Video Encoding 1080p60 H.264 / H.265

TETMX8MP-C Lcdchip industrial core board

Video Decoding 1080p60 VP8 / VP9 / H.264 / H.265

Note: TETMX8MPL-C does not include hardware video encoding and decoding functions.

Machine Learning and Vision

The TETMX8MPQ-C version integrates an NPU with up to 2.3 TOPS computing power, meeting lightweight edge AI computing requirements for machine vision, object recognition, intelligent cameras, video analytics and edge gateway applications.

NPU
2.3 TOPS

→

Lcdchip
TETMX8MP-C

Note: TETMX8MPL-C does not include the NPU function.

Stable High-Version Operating System

The TETMX8MP-C series supports stable embedded operating systems for industrial and AIoT product development. TETMX8MPQ-C supports Linux 5.4, Linux 6.1 and Android 11. TETMX8MPL-C supports Linux 5.4.

Linux 5.4 / Linux 6.1

Android 11

Note: TETMX8MPL-C is not adapted to Android 11.

Typical Product Applications

The Lcdchip TETMX8MP-C core board is designed for AI vision, edge computing, industrial control and multimedia terminals. It can be used in AI cameras, edge computing gateways, AI vending machines, medical equipment, industrial automation and video gesture interaction systems.

AI Smart Camera

Edge Computing Gateway

AI Vending Machine

Medical Equipment

Industrial Automation

Video Gesture Interaction

TETMX8MP-C Core Board Basic Specifications

Item	TETMX8MPQ-C	TETMX8MPL-C
CPU	NXP i.MX 8M Plus Quad	NXP i.MX 8M Plus QuadLite
Architecture	Cortex-A53 + Cortex-M7	Cortex-A53 + Cortex-M7
Core Configuration	4 × Cortex-A53 + 1 × Cortex-M7	4 × Cortex-A53 + 1 × Cortex-M7
Frequency	1.6GHz + 800MHz	1.6GHz + 800MHz
RAM	1GB / 2GB / 4GB LPDDR4	1GB / 2GB LPDDR4
ROM	8GB / 16GB eMMC	8GB / 16GB eMMC
GPU	GC7000UL 3D GPU, GC520L 2D GPU, OpenGL, OpenCL and Vulkan support	GC7000UL 3D GPU, GC520L 2D GPU, OpenGL, OpenCL and Vulkan support
NPU	2.3 TOPS	Not supported
Hardware Video Decoding	1080p60, VP8 / VP9 / H.264 / H.265	Not supported
Hardware Video Encoding	1080p60, H.264 / H.265	Not supported
Operating System	Linux 5.4, Linux 6.1, Android 11	Linux 5.4
Operating Temperature	-40°C to +85°C	-40°C to +85°C
Mechanical Size	36mm × 62mm	36mm × 62mm
Connection Method	Board-to-board connector with 2mm mating height	Board-to-board connector with 2mm mating height
Operating Voltage	5V	5V

TETMX8MP-C Core Board Functional Parameters

Function	Quantity	Parameters
USB	2	The processor integrates two USB 3.0 / 2.0 controllers with integrated PHY. Host mode supports SuperSpeed 5Gbit/s, High-Speed 480Mbit/s, Full-Speed 12Mbit/s and Low-Speed 1.5Mbit/s. Device mode supports SS, HS and FS.
PCIe	1	Supports one PCI Express Gen3 interface.
MIPI CSI	2	Provides two 4-lane MIPI camera serial interfaces, operating at up to 1.5Gbps.
MIPI DSI	1	Provides one 4-lane MIPI display serial interface, operating at up to 1.5Gbps. Supports 1080p60, WUXGA 1920 × 1200 at 60Hz, 1920 × 1440 at 60Hz, UWHD 2560 × 1080 at 60Hz and WQHD 2560 × 1440 through reduced blanking mode.
HDMI	1	Supports HDMI 2.0a display output up to 4Kp30 and HDMI 2.1 eARC.
LVDS	1	Single-channel 4-lane LVDS supports 720p60. Dual asynchronous channels with 8 data lanes and 2 clock lanes support 1920 × 1200p60.
Ethernet	Up to 2	Supports two RGMII interfaces, with one interface supporting TSN.
SD	Up to 2	SD2 supports 4-bit mode and 1.8V / 3.3V switching. SD1 supports 8-bit mode and 1.8V only.
UART	Up to 4	Maximum supported baud rate up to 4Mbps.
SPI	Up to 3	Maximum rate up to 52Mbit/s. Master and slave modes can be configured.
I²C	Up to 5	Supports standard mode up to 100Kbit/s and fast mode up to 400Kbit/s.
CAN	Up to 2	CAN communication controller based on the CAN FD protocol and compatible with CAN 2.0B. CAN FD support depends on the selected CPU version.
SAI	Up to 6	Synchronous audio interface supporting full-duplex serial interfaces such as I²S, AC97, TDM and codec / DSP interfaces.
SPDIF	Up to 1	Supports standard digital audio transmission through SPDIF interface.
PWM	Up to 4	Supports 16-bit counter functions.
QSPI	Up to 1	Occupied on the core board and connected to 16MB NOR Flash.
JTAG	1	Supports JTAG debugging interface.

Note: The parameters listed above are based on hardware design resources or theoretical CPU capabilities. Actual interface availability depends on carrier-board design, pin multiplexing, selected CPU version, software adaptation and customized project configuration.

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