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TET-MX8MPQ-SMARC NXP i.MX8M Plus AI Vision SMARC Core Board with 2.3 TOPS NPU

2026/8/11 16:29:14

The Lcdchip TET-MX8MPQ-SMARC core board is based on the NXP i.MX8M Plus processor and is designed for machine learning, vision, advanced multimedia and reliable industrial automation. It integrates a quad-core Arm Cortex-A53 processor up to 1.6GHz, a Cortex-M7 real-time core up to 800MHz, a 2.3 TOPS NPU, ISP, hardware video codec, 3D / 2D graphics acceleration, dual Gigabit Ethernet, USB 3.0, PCIe Gen 3, CAN-FD, SDIO 3.0 and rich audio interfaces.

Lcdchip TET-MX8MPQ-SMARC

Cortex-A53 Quad-Core CPU

1.6GHz Main Frequency

2.3 TOPS AI NPU

2GB / 4GB LPDDR4 RAM

16GB / 32GB eMMC ROM

-40°C~+85°C Wide Temperature

Six Reasons to Choose TET-MX8MPQ-SMARC

AI Vision Processor

NXP i.MX8M Plus platform with 2.3 TOPS NPU and integrated ISP.

High-Speed Communication

Dual Gigabit Ethernet, USB 3.0, PCIe Gen 3, SDIO 3.0 and CAN-FD.

4K Display and HiFi Audio

HDMI 4K output, LVDS, MIPI-DSI and advanced audio processing.

Advanced Multimedia

1080p60 H.265, H.264, VP9 and VP8 video decoding support.

3D and 2D Graphics

OpenGL ES, OpenCL and Vulkan support for rich graphical interfaces.

Industrial SMARC Design

SMARC 2.1 module with MXM3 edge connector for embedded products.

High-Speed Communication Interfaces

TET-MX8MPQ-SMARC provides rich high-speed communication interfaces, including two Gigabit Ethernet interfaces, two USB 3.0 controllers, PCIe Gen 3 and SDIO 3.0. It is suitable for 5G modules, dual-band Wi-Fi, high-definition video systems, industrial Ethernet, edge gateways and high-speed embedded data transmission.

2 × Ethernet
1Gbps

2 × USB 3.0

PCIe Gen 3

SDIO 3.0

2 × CAN-FD

4K Display and HiFi Voice Experience

The HDMI interface supports up to 4K display output. The board also integrates LVDS and MIPI-DSI display interfaces for flexible embedded display design. With Cadence Tensilica HiFi 4 DSP at 800MHz, S/PDIF, eARC, ASRC and PDM microphone input support, the platform provides a strong foundation for high-quality audio and video products.

HDMI Display Supports up to 4Kp30 display output

LVDS and MIPI-DSI Flexible LCD integration for industrial and AIoT terminals

HiFi 4 DSP Audio Processing

The platform integrates Cadence Tensilica HiFi 4 DSP at 800MHz, supporting advanced audio processing, voice interaction and high-quality multimedia terminal applications.

Rich Audio Interfaces

The platform supports I²S, SAI, S/PDIF, PDM microphone input, enhanced audio return channel and asynchronous sample-rate conversion according to system configuration.

Advanced Multimedia Technology

TET-MX8MPQ-SMARC supports H.264 and H.265 hardware encoding, and H.265, VP9, VP8 and H.264 hardware decoding at up to 1080p60. The platform also supports display enhancement technologies that improve contrast and color saturation for richer visual performance.

Encoding H.265 / HEVC and H.264 / AVC
Up to 1080p60

Decoding H.265, VP9, VP8 and H.264
Up to 1080p60

3D and 2D Graphics Acceleration

The integrated 3D and 2D GPU supports OpenGL ES 1.1, OpenGL ES 2.0, OpenGL ES 3.0, OpenCL 1.2 and Vulkan. This enables smooth UI rendering, graphical acceleration, multimedia interaction and embedded visual applications that require high-performance graphics.

3D Rendering Support

Supports 3D graphics workloads for advanced user interfaces, visualization dashboards, smart display panels and multimedia systems.

2D UI Acceleration

Supports efficient 2D graphics processing for icons, animations, industrial HMI interfaces and commercial embedded display products.

Machine Learning and Vision

The integrated NPU delivers up to 2.3 TOPS AI computing power, helping meet lightweight edge AI requirements. It supports application scenarios such as image recognition, object detection, voice recognition, smart home interaction, mobile vision processing and intelligent industrial perception.

2.3 TOPS NPU AI acceleration for lightweight edge inference

Vision AI Suitable for recognition, detection and intelligent image processing

Dual Image Signal Processor

The platform integrates a high-performance image signal processor that can process image data in real time, optimize image quality and improve visual results. With dual 4-lane MIPI-CSI camera interfaces, the board supports efficient vision-system development for AI cameras, smart medical systems and industrial inspection.

2 × MIPI-CSI Two 4-lane camera serial interfaces up to 1.5Gbps

ISP Processing Image optimization for clearer and more detailed vision output

Typical Product Applications

The Lcdchip TET-MX8MPQ-SMARC core board is designed for smart home, industrial IoT, intelligent medical, smart transportation, 5G networks, high-definition video, dual-band Wi-Fi, high-speed industrial Ethernet and edge AI applications.

Smart Medical

Smart Home

Smart Transportation

Industrial IoT

AI Vision Terminal

Edge Gateway

5G Network Device

Industrial Automation

TET-MX8MPQ-SMARC Core Board Basic Specifications

Processor	NXP i.MX8MPQ
CPU Architecture	4 × Cortex-A53 @ 1.6GHz + Cortex-M7 @ 800MHz
NPU	2.3 TOPS AI computing performance
GPU	Supports 3D and 2D GPU acceleration, OpenGL ES 1.1 / 2.0 / 3.0, OpenCL 1.2 and Vulkan
VPU Decoding	HEVC / H.265, VP9, VP8 and AVC / H.264 up to 1080p60
VPU Encoding	H.265 / HEVC and H.264 / AVC up to 1080p60
RAM	2GB / 4GB LPDDR4
ROM	16GB / 32GB eMMC
Operating Voltage	5V
Operating Temperature	-40°C to +85°C
Connection Method	SMARC 2.1, MXM3 edge connector, 314 pins, 0.5mm pitch
Operating System	Linux 6.1.36 + Qt 6.5.0
System Flashing Method	USB OTG

TET-MX8MPQ-SMARC Functional Parameters

Function	Quantity	Parameters
USB 3.0	2	Includes two USB 3.0 / 2.0 controllers with integrated PHY.
USB 2.0	5	Supports High-Speed, Full-Speed and Low-Speed USB modes.
MIPI CSI	2	Provides two 4-lane MIPI camera serial interfaces, operating at up to 1.5Gbps.
LVDS	2	Supports display resolution up to 1920 × 1080p60.
HDMI	1	Supports display resolution up to 4Kp30.
Ethernet	2	EMAC interfaces supporting 10 / 100 / 1000Mbps data rates, with one interface supporting TSN.
PCIe	1	Supports PCI Express Gen 3.
CAN-FD	2	CAN communication controller based on CAN FD protocol, compatible with CAN 2.0B and ISO 11898-1.
SDIO	1	Supports SDIO 3.0.
IIS / SAI	2	Synchronous audio interface supporting full-duplex serial audio interfaces such as I²S, AC97, TDM and codec / DSP.
SPI	2	Maximum rate up to 52Mbit/s. Master and slave modes can be configured.
I²C	5	Supports data rates up to 320kbps.
UART	4	Maximum supported baud rate up to 4Mbps.
PWM	3	Supports 16-bit counter functions.
GPIO	More than 14	General-purpose input and output interfaces for external control.
Wi-Fi and Bluetooth	1	Supports Wi-Fi 5 MIMO and Bluetooth 5.3 through SDIO 3.0 + UART direct processor connection.
JTAG	1	Compliant with IEEE 1149.1 JTAG testability standard.

Note: The parameters above are based on hardware design resources or theoretical CPU capabilities. Actual interface availability, multimedia performance, AI model deployment, display output, Wi-Fi / Bluetooth configuration and operating-system functions depend on carrier-board design, pin multiplexing, firmware adaptation, software configuration and customized project requirements.