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TETMX8MQ-C NXP i.MX8MQ Quad-Core Industrial Core Board with 4K Display and Linux Qt

2026/8/11 15:30:19

The Lcdchip TETMX8MQ-C core board is based on the NXP i.MX8MQ processor, featuring a quad-core Arm Cortex-A53 architecture with a maximum frequency of 1.3GHz and 2GB DDR4 memory. Designed for high performance and low power consumption, it supports fanless industrial applications and provides reliable operation for edge computing, HMI, 5G terminals, video systems and industrial automation devices.

Lcdchip TETMX8MQ-C

4-Core Cortex-A53 CPU

1.3GHz Main Frequency

2GB DDR4 RAM

8GB eMMC ROM

12V DC Power Input

-40°C~+85°C Wide Temperature

4K + 1080p Independent Dual-Screen Display

The TETMX8MQ-C supports HDMI and MIPI-DSI independent dual-screen display output, with HDMI supporting up to 4K ultra-high-definition resolution. Through dedicated conversion chips, HDMI can be converted to eDP, LVDS or RGB, while MIPI-DSI can be converted to LVDS or HDMI, giving developers flexible display options for different terminal designs.

HDMI Output Up to 4096 × 2160 at 60Hz through HDMI 2.0a

MIPI-DSI Output Up to 1920 × 1080 at 60Hz for compatible LCD panels

High Performance, Low Power

The NXP i.MX8MQ processor combines four Cortex-A53 cores with a Cortex-M4 real-time processor. This architecture provides strong application performance while meeting low-power and fanless design requirements in industrial environments.

Industrial Reliability

With a working temperature range from -40°C to +85°C, board-to-board connector design and stable Linux software support, the TETMX8MQ-C is suitable for long-term embedded deployment.

Dual Display Expansion

HDMI and MIPI-DSI outputs can be used for independent display designs. This supports industrial HMI, smart terminals, multimedia panels and equipment requiring two different screens.

Flexible Display Conversion

Using external conversion circuits, HDMI and MIPI-DSI signals can be adapted to eDP, LVDS, RGB or other common display interfaces according to the carrier-board design.

H.265 and VP9 Decoding Reduce Bandwidth Usage

The TETMX8MQ-C supports 4Kp60 H.265 and VP9 decoding. Compared with traditional H.264 encoding, H.265 can improve decoding efficiency and reduce bandwidth and storage usage for video transmission applications. Under the same 1080p image quality, storage and bandwidth consumption can be significantly reduced.

H.264 1080p same image quality
Higher storage and bandwidth usage

H.265 1080p same image quality
Lower storage and bandwidth usage

Rich High-Speed Peripheral Interfaces

The TETMX8MQ-C provides rich high-speed interfaces including MIPI-CSI, USB 3.0, PCIe 2.0, UART and Gigabit Ethernet. It can connect high-definition cameras, industrial cameras, 5G modules, 4G modules, FPGA devices, SSD storage, PLCs and high-speed Ethernet equipment.

2 × MIPI-CSI

2 × USB 3.0

2 × PCIe 2.0

4 × UART

1Gb Ethernet

Multi-Camera Access

The TETMX8MQ-C provides two MIPI-CSI interfaces, supporting two MIPI-CSI cameras for binocular recognition and vision applications. Two USB 3.0 interfaces can connect UVC USB cameras and compatible USB 3.0 industrial cameras.

MIPI-CSI Cameras 2 × MIPI-CSI, 4-lane support, suitable for dual-camera vision

USB 3.0 Cameras Supports UVC cameras and compatible industrial USB cameras

5G High-Speed Communication

The TETMX8MQ-C can connect a compatible 5G communication module through the USB 3.0 interface, meeting the requirements of high-speed network access for edge terminals, video systems, communication gateways and intelligent industrial equipment.

TETMX8MQ-C USB 3.0 connection for 5G communication module

TETMX8MQ-C supports USB 3.0 connection for compatible 5G modules.

PCIe High-Speed Interfaces

The TETMX8MQ-C provides two PCIe 2.0 interfaces, which can be used to connect high-speed peripherals such as SSDs, Wi-Fi 6 modules, V2X communication modules and FPGA acquisition cards.

SSD Storage Expansion

PCIe 2.0 can be used for high-speed SSD storage expansion, supporting data logging, multimedia files and local databases.

Wi-Fi 6 and V2X Expansion

PCIe interfaces support compatible wireless and communication modules for industrial connectivity, V2X terminals and high-speed edge gateways.

Linux 5.4.3 + Qt 5.13

The TETMX8MQ-C supports Linux 5.4.3 with Qt 5.13 64-bit software environment, helping developers build stable, secure and visually refined human-machine interfaces for industrial and commercial products.

Linux 5.4.3 Stable embedded Linux operating system

Qt 5.13 Efficient UI framework for HMI development

Typical Product Applications

The Lcdchip TETMX8MQ-C core board is suitable for 5G terminals, edge computing gateways, HMI systems, V2X RSU, fuel dispensers, blood analyzers, PCR equipment, ventilators, medical systems, electric power, industrial automation, smart transportation, environmental monitoring, smart water and energy management.

Medical Equipment

Electric Power

Industrial Automation

Smart Transportation

Edge Computing Gateway

5G Terminal

Industrial HMI

V2X System

TETMX8MQ-C Core Board Basic Specifications

CPU	NXP i.MX8MQ
Architecture	Quad-core Cortex-A53 + Cortex-M4
Main Frequency	1.3GHz
RAM	2GB DDR4
ROM	8GB eMMC
Operating Temperature	-40°C to +85°C
Mechanical Size	40mm × 64mm
Connection Method	Board-to-board connector
Operating Voltage	12V
Operating System	Linux 5.4.3 + Qt 5.13.2

TETMX8MQ-C Core Board Functional Parameters

Function	Quantity	Parameters
USB	2	The processor integrates two USB 3.0 / 2.0 controllers with integrated PHY. Supports SuperSpeed 5Gbit/s, High-Speed 480Mbit/s, Full-Speed 12Mbit/s and Low-Speed 1.5Mbit/s.
PCIe	2	Supports two PCIe 2.0 interfaces.
MIPI CSI	2	Each lane supports high-speed mode from 80Mbps to 1.5Gbps. Four-lane configuration can support 4K at 30fps.
MIPI DSI	1	Supports display resolution up to 1920 × 1080 at 60Hz.
HDMI	1	Supports HDMI 2.0a with resolution up to 4096 × 2160 at 60Hz.
Ethernet	1	Supports one RGMII interface. Carrier-board adaptation can implement 1000M / 100M / 10M auto-negotiation Ethernet.
SD / SDIO	1	Supports 1-bit and 4-bit SD / SDIO modes. SDR104 mode can provide up to 832Mbps using four parallel data lines. DDR50 mode can provide up to 400Mbps using four parallel data lines.
UART	Up to 4	Four UART ports can be configured as 5-wire serial ports. Maximum supported baud rate is 4Mbit/s. One port can be configured as A53 debug UART and one as M4 debug UART. Additional UART expansion can be implemented through USB or SPI.
SPI	Up to 3	ECSPI includes a 64 × 32 RXFIFO and a 64 × 32 TXFIFO. Maximum supported speed is 52Mbit/s.
I²C	Up to 3	Supports standard mode up to 100Kbit/s and fast mode up to 400Kbit/s.
SAI	Up to 5	Supports full-duplex serial interfaces with frame synchronization, including I²S, AC97, TDM and codec / DSP. Includes one SAI with 16 Tx and 16 Rx channels, one SAI with 8 Tx and 8 Rx channels and three SAI with 2 Tx and 2 Rx channels.
SPDIF	1	Supports S/PDIF input and output.
PWM	Up to 4	Supports 16-bit up-counting counter, clock source selection, 12-bit prescaler, sound and melody generation, and active-high or active-low output configuration.
Parallel Bus	1	Supports 8-bit NAND Flash, including Raw MLC / SLC devices, up to 62-bit BCH ECC and ONFi 3.2 compatibility. Clock rate up to 100MHz and data rate up to 200MB/s.
QSPI	Up to 2	Supports single data rate and dual data rate operation modes.

Note: The parameters above are based on hardware design resources or theoretical CPU capabilities. Actual interface availability depends on carrier-board design, pin multiplexing, firmware adaptation, software configuration and customized project requirements.