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Omron Electronics Inc-EMC Div XR2C-3202
- Part No.:
- XR2C-3202
- Manufacturer:
- Omron Electronics Inc-EMC Div
- Category:
- IC Sockets
- Package:
- Description:
- CONN
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
XR2C-3202 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Omron Electronics Inc-EMC Div
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- -
- Number of Positions or Pins (Grid):
- -
- Pitch - Mating:
- -
- Contact Finish - Mating:
- -
- Contact Finish Thickness - Mating:
- -
- Contact Material - Mating:
- -
- Mounting Type:
- -
- Features:
- -
- Termination:
- -
- Pitch - Post:
- -
- Contact Finish - Post:
- -
- Contact Finish Thickness - Post:
- -
- Contact Material - Post:
- -
- Housing Material:
- -
- Operating Temperature:
- -
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| Part Number | XR2C-0311-N | XR2C-2011-N | XR2C1011N | XR2C-3205 | XR2C-2015 |
| Manufacturer | Omron Electronics Inc-EMC Div | Omron Electronics Inc-EMC Div | Omron Electronics Inc-EMC Div | Omron Electronics Inc-EMC Div | Omron Electronics Inc-EMC Div |
| Series | XR2 | XR2 | XR2 | XR2 | XR2 |
| Packaging | Bulk | Bulk | Bulk | Bulk | Bulk |
| Product Status | Active | Active | Active | Active | Active |
| Type | SIP | SIP | SIP | SIP | SIP |
| Number of Positions or Pins (Grid) | 3 (1 x 3) | 20 (1 x 20) | 10 (1 x 10) | 32 (1 x 32) | 20 (1 x 20) |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 30.0µin (0.76µm) | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Mounting Type | Through Hole | Through Hole | Threaded | Through Hole | Through Hole |
| Features | Closed Frame | Closed Frame | - | Closed Frame | Closed Frame |
| Termination | Solder | Solder | Solder | Solder | Solder |
| Pitch - Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Post | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 30.0µin (0.76µm) | 10.0µin (0.25µm) |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | Brass | Beryllium Copper | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
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