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Omron Electronics Inc-EMC Div XR2C-3200-HSG

Name: XR2C-3200-HSG
Brand: Omron Electronics Inc-EMC Div
SKU: XR2C-3200-HSG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XR2C-3200-HSG

Manufacturer:: Omron Electronics Inc-EMC Div

Category:: IC Sockets

Package:

Description:: CONN IC SOCKET 32POS

Quantity:: Add To Cart Add To RFQ list

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Ext Price:$0

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XR2C-3200-HSG Information

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Product attributes: Attribute value

Manufacturer:: Omron Electronics Inc-EMC Div

Series:: XR2

Packaging:: Bulk

Product Status:: Active

Type:: Housing

Number of Positions or Pins (Grid):: 32 (1 x 32)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: -

Contact Finish Thickness - Mating:: -

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Closed Frame

Termination:: Wire Wrap

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: -

Contact Finish Thickness - Post:: -

Contact Material - Post:: Beryllium Copper

Housing Material:: Polybutylene Terephthalate (PBT), Glass Filled

Operating Temperature:: -55°C ~ 125°C

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Part Number	XR2C-0311-N	XR2C-2011-N	XR2C1011N	XR2C-3205	XR2C-2015
Manufacturer	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div
Series	XR2	XR2	XR2	XR2	XR2
Packaging	Bulk	Bulk	Bulk	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	SIP	SIP	SIP	SIP	SIP
Number of Positions or Pins (Grid)	3 (1 x 3)	20 (1 x 20)	10 (1 x 10)	32 (1 x 32)	20 (1 x 20)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	30.0µin (0.76µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Threaded	Through Hole	Through Hole
Features	Closed Frame	Closed Frame	-	Closed Frame	Closed Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	30.0µin (0.76µm)	10.0µin (0.25µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Brass	Beryllium Copper	Beryllium Copper
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C