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TE Connectivity AMP Connectors 8080-1G35
- Part No.:
- 8080-1G35
- Manufacturer:
- TE Connectivity AMP Connectors
- Category:
- IC Sockets
- Package:
- Datasheet:
-
8080-1G35.pdf
- Description:
- CONN SOCKET TRANSIST TO-3 3POS
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
8080-1G35 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- TE Connectivity AMP Connectors
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Transistor, TO-3
- Number of Positions or Pins (Grid):
- 3 (Oval)
- Pitch - Mating:
- -
- Contact Finish - Mating:
- Tin-Lead
- Contact Finish Thickness - Mating:
- 200.0µin (5.08µm)
- Contact Material - Mating:
- Beryllium Copper
- Mounting Type:
- Chassis Mount
- Features:
- Closed Frame
- Termination:
- Solder
- Pitch - Post:
- -
- Contact Finish - Post:
- Tin-Lead
- Contact Finish Thickness - Post:
- 20.0µin (0.51µm)
- Contact Material - Post:
- Beryllium Copper
- Housing Material:
- Diallyl Phthalate (DAP)
- Operating Temperature:
- -55°C ~ 125°C
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| Part Number | 8080-1G1 | 8080-1G15 | 8080-1G24 | 8080-1G14 | 8080-1G31 |
| Manufacturer | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors |
| Series | 8080 | 8080 | - | 8080 | 8060 |
| Packaging | Bulk | Bulk | Bulk | Bulk | Bulk |
| Product Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Type | Transistor, TO-3 | Transistor, TO-3 | Transistor, TO-3 | Transistor, TO-3 | Transistor, TO-3 |
| Number of Positions or Pins (Grid) | 4 (Round) | 3 (Oval) | 3 (Round) | 3 (Oval) | 3 (Oval) |
| Pitch - Mating | - | - | - | - | - |
| Contact Finish - Mating | Tin-Lead | Tin-Lead | Tin-Lead | Tin-Lead | Tin |
| Contact Finish Thickness - Mating | - | 200.0µin (5.08µm) | 20.0µin (0.51µm) | 200.0µin (5.08µm) | - |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Mounting Type | Through Hole | Chassis Mount | Chassis Mount | Through Hole | Chassis Mount |
| Features | Closed Frame | Closed Frame | Closed Frame | Closed Frame | Closed Frame |
| Termination | Solder | Solder | Solder | Solder | Solder |
| Pitch - Post | - | - | - | - | - |
| Contact Finish - Post | Tin-Lead | Tin-Lead | Tin-Lead | Tin-Lead | Tin |
| Contact Finish Thickness - Post | - | 200.0µin (5.08µm) | 20.0µin (0.51µm) | - | - |
| Contact Material - Post | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Housing Material | Fluoropolymer (FP) | Fluoropolymer (FP) | Diallyl Phthalate (DAP) | Phenolic | Polytetrafluoroethylene (PTFE) |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
- Include Parts
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